Power Distribution Networks with On-Chip Decoupling Capacitors

Author: Renatas Jakushokas,Mikhail Popovich,Andrey V. Mezhiba,Selçuk Köse,Eby G. Friedman

Publisher: Springer Science & Business Media

ISBN: 9781441978714

Category: Technology & Engineering

Page: 644

View: 7112

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This book describes methods for distributing power in high speed, high complexity integrated circuits with power levels exceeding many tens of watts and power supplies below a volt. It provides a broad and cohesive treatment of power distribution systems and related design problems, including both circuit network models and design techniques for on-chip decoupling capacitors, providing insight and intuition into the behavior and design of on-chip power distribution systems. Organized into subareas to provide a more intuitive flow to the reader, this second edition adds more than a hundred pages of new content, including inductance models for interdigitated structures, design strategies for multi-layer power grids, advanced methods for efficient power grid design and analysis, and methodologies for simultaneously placing on-chip multiple power supplies and decoupling capacitors. The emphasis of this additional material is on managing the complexity of on-chip power distribution networks.

On-Chip Power Delivery and Management

Author: Inna P. Vaisband,Renatas Jakushokas,Mikhail Popovich,Andrey V. Mezhiba,Selçuk Köse,Eby G. Friedman

Publisher: Springer

ISBN: 3319293958

Category: Technology & Engineering

Page: 742

View: 7300

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This book describes methods for distributing power in high speed, high complexity integrated circuits with power levels exceeding many tens of watts and power supplies below a volt. It provides a broad and cohesive treatment of power delivery and management systems and related design problems, including both circuit network models and design techniques for on-chip decoupling capacitors, providing insight and intuition into the behavior and design of on-chip power distribution systems. Organized into subareas to provide a more intuitive flow to the reader, this fourth edition adds more than a hundred pages of new content, including inductance models for interdigitated structures, design strategies for multi-layer power grids, advanced methods for efficient power grid design and analysis, and methodologies for simultaneously placing on-chip multiple power supplies and decoupling capacitors. The emphasis of this additional material is on managing the complexity of on-chip power distribution networks.

Integrated Circuit and System Design: Power and Timing Modeling, Optimization and Simulation

19th International Workshop, PATMOS 2009, Delft, The Netherlands, September 9-11, 2009, Revised Selected Papers

Author: José Monteiro,Rene van Leuken

Publisher: Springer

ISBN: 364211802X

Category: Computers

Page: 370

View: 9302

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This book constitutes the thoroughly refereed post-conference proceedings of 19th International Workshop on Power and Timing Modeling, Optimization and Simulation, PATMOS 2009, featuring Integrated Circuit and System Design, held in Delft, The Netherlands during September 9-11, 2009. The 26 revised full papers and 10 revised poster papers presented were carefully reviewed and selected from numerous submissions. The papers are organized in topical sections on variability & statistical timing, circuit level techniques, power management, low power circuits & technology, system level techniques, power & timing optimization techniques, self-timed circuits, low power circuit analysis & optimization, and low power design studies.

Power Distribution Networks in High Speed Integrated Circuits

Author: Andrey Mezhiba,Eby G. Friedman

Publisher: Springer Science & Business Media

ISBN: 146150399X

Category: Technology & Engineering

Page: 280

View: 7224

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Distributing power in high speed, high complexity integrated circuits has become a challenging task as power levels exceeding tens of watts have become commonplace while the power supply is plunging toward one volt. This book is dedicated to this important subject. The primary purpose of this monograph is to provide insight and intuition into the behavior and design of power distribution systems for high speed, high complexity integrated circuits.

Power Integrity Modeling and Design for Semiconductors and Systems

Author: Madhavan Swaminathan,Ege Engin

Publisher: Pearson Education

ISBN: 0132797178

Category: Technology & Engineering

Page: 496

View: 415

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The First Comprehensive, Example-Rich Guide to Power Integrity Modeling Professionals such as signal integrity engineers, package designers, and system architects need to thoroughly understand signal and power integrity issues in order to successfully design packages and boards for high speed systems. Now, for the first time, there's a complete guide to power integrity modeling: everything you need to know, from the basics through the state of the art. Using realistic case studies and downloadable software examples, two leading experts demonstrate today's best techniques for designing and modeling interconnects to efficiently distribute power and minimize noise. The authors carefully introduce the core concepts of power distribution design, systematically present and compare leading techniques for modeling noise, and link these techniques to specific applications. Their many examples range from the simplest (using analytical equations to compute power supply noise) through complex system-level applications. The authors Introduce power delivery network components, analysis, high-frequency measurement, and modeling requirements Thoroughly explain modeling of power/ground planes, including plane behavior, lumped modeling, distributed circuit-based approaches, and much more Offer in-depth coverage of simultaneous switching noise, including modeling for return currents using time- and frequency-domain analysis Introduce several leading time-domain simulation methods, such as macromodeling, and discuss their advantages and disadvantages Present the application of the modeling methods on several advanced case studies that include high-speed servers, high-speed differential signaling, chip package analysis, materials characterization, embedded decoupling capacitors, and electromagnetic bandgap structures This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists. It will also be valuable to developers building software that helps to analyze high-speed systems.

Coupled Data Communication Techniques for High-Performance and Low-Power Computing

Author: Ron Ho,Robert Drost

Publisher: Springer Science & Business Media

ISBN: 9781441965882

Category: Technology & Engineering

Page: 206

View: 6910

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Wafer-scale integration has long been the dream of system designers. Instead of chopping a wafer into a few hundred or a few thousand chips, one would just connect the circuits on the entire wafer. What an enormous capability wafer-scale integration would offer: all those millions of circuits connected by high-speed on-chip wires. Unfortunately, the best known optical systems can provide suitably ?ne resolution only over an area much smaller than a whole wafer. There is no known way to pattern a whole wafer with transistors and wires small enough for modern circuits. Statistical defects present a ?rmer barrier to wafer-scale integration. Flaws appear regularly in integrated circuits; the larger the circuit area, the more probable there is a ?aw. If such ?aws were the result only of dust one might reduce their numbers, but ?aws are also the inevitable result of small scale. Each feature on a modern integrated circuit is carved out by only a small number of photons in the lithographic process. Each transistor gets its electrical properties from only a small number of impurity atoms in its tiny area. Inevitably, the quantized nature of light and the atomic nature of matter produce statistical variations in both the number of photons de?ning each tiny shape and the number of atoms providing the electrical behavior of tiny transistors. No known way exists to eliminate such statistical variation, nor may any be possible.

Introduction to VLSI Systems

A Logic, Circuit, and System Perspective

Author: Ming-Bo Lin

Publisher: CRC Press

ISBN: 1439897328

Category: Technology & Engineering

Page: 915

View: 6454

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With the advance of semiconductors and ubiquitous computing, the use of system-on-a-chip (SoC) has become an essential technique to reduce product cost. With this progress and continuous reduction of feature sizes, and the development of very large-scale integration (VLSI) circuits, addressing the harder problems requires fundamental understanding of circuit and layout design issues. Furthermore, engineers can often develop their physical intuition to estimate the behavior of circuits rapidly without relying predominantly on computer-aided design (CAD) tools. Introduction to VLSI Systems: A Logic, Circuit, and System Perspective addresses the need for teaching such a topic in terms of a logic, circuit, and system design perspective. To achieve the above-mentioned goals, this classroom-tested book focuses on: Implementing a digital system as a full-custom integrated circuit Switch logic design and useful paradigms that may apply to various static and dynamic logic families The fabrication and layout designs of complementary metal-oxide-semiconductor (CMOS) VLSI Important issues of modern CMOS processes, including deep submicron devices, circuit optimization, interconnect modeling and optimization, signal integrity, power integrity, clocking and timing, power dissipation, and electrostatic discharge (ESD) Introduction to VLSI Systems builds an understanding of integrated circuits from the bottom up, paying much attention to logic circuit, layout, and system designs. Armed with these tools, readers can not only comprehensively understand the features and limitations of modern VLSI technologies, but also have enough background to adapt to this ever-changing field.

GLSVLSI '05

proceedings of the 2005 ACM Great Lakes Symposium on VLSI, Radisson Hotel Downtown, Chicago, Illinois, USA, April 17-19, 2005

Author: ACM Special Interest Group on Design Automation

Publisher: N.A

ISBN: N.A

Category: Technology & Engineering

Page: 506

View: 3358

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ICCAD-2000

IEEE/ACM International Conference on Computer-Aided Design : November 5-9, 2000, DoubleTree Hotel, San Jose, CA

Author: N.A

Publisher: IEEE

ISBN: 9780780364455

Category: Computers

Page: 575

View: 3654

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This text constitutes the proceedings from the International Conference on Computer-Aided Design that took place in 2000. Topics covered include physical design and testing, synthesis and systems design, and verification, modelling and simulation.

Power Integrity Analysis and Management for Integrated Circuits

Author: Raj Nair,Donald Bennett

Publisher: Prentice Hall

ISBN: 0137048289

Category: Technology & Engineering

Page: 432

View: 4776

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New Techniques and Tools for Ensuring On-Chip Power Integrity—Down to Nanoscale As chips continue to scale, power integrity issues are introducing unexpected project complexity and cost. In this book, two leading industry innovators thoroughly discuss the power integrity challenges that engineers face in designing at nanoscale levels, introduce new analysis and management techniques for addressing these issues, and provide breakthrough tools for hands-on problem solving. Raj Nair and Dr. Donald Bennett first provide a complete foundational understanding of power integrity, including ULSI issues, practical aspects of power delivery, and the benefits of a total power integrity approach to optimizing chip physical designs. They introduce advanced power distribution network modeling, design, and analysis techniques that highlight abstraction and physics-based analysis, while also incorporating traditional circuit- and field-solver based approaches. They also present advanced techniques for floorplanning and power integrity management, and help designers anticipate emerging challenges associated with increased integration. Anasim RLCSim.exe, a new tool for power integrity aware floorplanning, is downloadable for free at anasim.com/category/software. The authors Systematically explore power integrity implications, analysis, and management for integrated circuits Present practical examples and industry best practices for a broad spectrum of chip design applications Discuss distributed and high-bandwidth voltage regulation, differential power path design, and the significance of on-chip inductance to power integrity Review both traditional and advanced modeling techniques for integrated circuit power integrity analysis, and introduce continuum modeling Explore chip, package, and board interactions for power integrity and EMI, and bring together industry best practices and examples Introduce advanced concepts for power integrity management, including non-linear capacitance devices, impedance modulation, and active noise regulation Power Integrity Analysis and Management for Integrated Circuits’ coverage of both fundamentals and advanced techniques will make this book indispensable to all engineers responsible for signal integrity, power integrity, hardware, or system design—especially those working at the nanoscale level.

ICCAD

Author: N.A

Publisher: N.A

ISBN: 9780780372474

Category: Integrated circuits

Page: 656

View: 3069

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CMOS RF Modeling, Characterization and Applications

Author: M. Jamal Deen,Tor A. Fjeldly

Publisher: World Scientific

ISBN: 9789810249052

Category: Science

Page: 409

View: 6609

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CMOS technology has now reached a state of evolution, in terms of both frequency and noise, where it is becoming a serious contender for radio frequency (RF) applications in the GHz range. Cutoff frequencies of about 50 GHz have been reported for 0.18 æm CMOS technology, and are expected to reach about 100 GHz when the feature size shrinks to 100 nm within a few years. This translates into CMOS circuit operating frequencies well into the GHz range, which covers the frequency range of many of today's popular wireless products, such as cell phones, GPS (Global Positioning System) and Bluetooth. Of course, the great interest in RF CMOS comes from the obvious advantages of CMOS technology in terms of production cost, high-level integration, and the ability to combine digital, analog and RF circuits on the same chip. This book discusses many of the challenges facing the CMOS RF circuit designer in terms of device modeling and characterization, which are crucial issues in circuit simulation and design.

Proceedings

Author: John Chickanosky,Dong Ha,Richard Auletta

Publisher: N.A

ISBN: 9780780384453

Category: Systems on a chip

Page: 402

View: 7130

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